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Coherent and semicoherent interfaces in titanium: structure, thermodynamics, migration

Siqi Wang1*, Tongqi Wen2*, Jian Han1*, David Srolovitz2*

1 Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong SAR, China

2 Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong SAR, China

* Corresponding authors emails: swang347-c@my.cityu.edu.hk, tongqwen@hku.hk, jianhan@cityu.edu.hk, srol@hku.hk
DOI10.24435/materialscloud:3s-h1 [version v1]

Publication date: Nov 07, 2023

How to cite this record

Siqi Wang, Tongqi Wen, Jian Han, David Srolovitz, Coherent and semicoherent interfaces in titanium: structure, thermodynamics, migration, Materials Cloud Archive 2023.167 (2023), https://doi.org/10.24435/materialscloud:3s-h1


The α/β interface is central to the microstructure and mechanical properties of titanium alloys. We investigate the structure, thermodynamics and migration of the coherent and semicoherent Ti α/β interfaces as a function of temperature and misfit strain via molecular dynamics (MD) simulations, thermodynamic integration and an accurate, DFT-trained Deep Potential. The structure of an equilibrium semicoherent interface consists of an array of steps, an array of misfit dislocations, and coherent terraces. Analysis determines the dislocation and step (disconnection) array structure and habit plane. The MD simulations show the detailed interface morphology dictated by intersecting disconnection arrays. The steps are shown to facilitate α/β interface migration, while the misfit dislocations lead to interface drag; the drag mechanism is different depending on the direction of interface migration. These results are used to predict the nature of α phase nucleation on cooling through the α-β phase transition.

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External references

Siqi Wang, Tongqi Wen, Jian Han, David J. Srolovitz, arXiv:2311.02897 [cond-mat.mtrl-sci] doi:https://doi.org/10.48550/arXiv.2311.02897


molecular dynamics simulation free energy Titanium interfaces

Version history:

2023.167 (version v1) [This version] Nov 07, 2023 DOI10.24435/materialscloud:3s-h1