Searching for the thinnest metallic wire
Creators
- 1. Theory and Simulation of Materials (THEOS), École Polytechnique Fédérale de Lausanne (EPFL), CH - 1015 Lasuanne, Vaud, Switzerland
- 2. National Centre for Computational Design and Discovery of Novel Materials (MARVEL), École Polytechnique Fédérale de Lausanne (EPFL), CH - 1015 Lausanne, Vaud, Switzerland
- 3. Università degli studi di Milano Bicocca, Piazza dell'Ateneo Nuovo 1, 20126 Milano, Italy
- 4. Laboratory for Materials Simulations, Paul Scherrer Institut (PSI), 5232 Villigen, Switzerland
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Description
One-dimensional materials have gained much attention in the last decades: from carbon nanotubes to ultrathin nanowires, to few-atom atomic chains, these can all display unique electronic properties and great potential for next-generation applications. Exfoliable bulk materials could naturally provide a source for one-dimensional wires with well defined structure and electronics. Here, we explore a database of one-dimensional materials that could be exfoliated from experimentally known three-dimensional Van-der-Waals compounds, searching metallic wires that are resilient to Peierls distortions and could act as vias or interconnects for future downscaled electronic devices. As the one-dimensional nature makes these wires particularly susceptible to dynamical instabilities, we carefully characterise vibrational properties to identify stable phases and characterize electronic and dynamical properties. Our search identifies several novel and stable wires; notably, we identify what could be the thinnest possible exfoliable metallic wire, CuC₂, coming a step closer to the ultimate limit in materials downscaling.
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References
Preprint (Preprint of the paper where data are discussed and explained) C. Cignarella, D. Campi, N. Marzari (2023), doi: 10.48550/arXiv.2312.16968