Uncovering the origin of interface stress enhancement and compressive-to-tensile stress transition in immiscible nanomultilayers
Creators
- 1. Empa - Swiss Federal Laboratories for Materials Science and Technology, Thun, Switzerland
- 2. National Centre for Computational Design and Discovery of Novel Materials MARVEL, Empa, Thun, Switzerland
- 3. Empa - Swiss Federal Laboratories for Materials Science and Technology, Dubendorf, Switzerland
- 4. School of Engineering, Brown University, Providence, RI 02906 USA
- 5. National Centre for Computational Design and Discovery of Novel Materials MARVEL, EPFL, Lausanne, Switzerland
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Description
The intrinsic stress in nanomultilayers (NMLs) is typically dominated by interface stress, which is particularly high in immiscible Cu/W NMLs. Here, atomistic simulations with a chemically-accurate neural network potential reveal the role of interfacial intermixing and metastable phase formation on the interface stress levels. These results rationalize an experimentally-reported compressive-to-tensile transition as a function of NML deposition conditions and the extremely high interface stresses under some conditions.
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References
Preprint Y. Hu, G. Lorenzin, J. Yeom, M. Liyanage, W. Curtin, L. Jeurgens, J. Janczak-Rusch, C. Cancellieri, V. Turlo, to be submitted