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Uncovering the origin of interface stress enhancement and compressive-to-tensile stress transition in immiscible nanomultilayers

Yang Hu1,2, Giacomo Lorenzin3, Jeyun Yeom3, Manura Liyanage1,2, William Curtin4,5, Lars Jeurgens3, Jolanta Janczak-Rusch3, Claudia Cancellieri3, Vladyslav Turlo1*

1 Empa - Swiss Federal Laboratories for Materials Science and Technology, Thun, Switzerland

2 National Centre for Computational Design and Discovery of Novel Materials MARVEL, Empa, Thun, Switzerland

3 Empa - Swiss Federal Laboratories for Materials Science and Technology, Dubendorf, Switzerland

4 School of Engineering, Brown University, Providence, RI 02906 USA

5 National Centre for Computational Design and Discovery of Novel Materials MARVEL, EPFL, Lausanne, Switzerland

* Corresponding authors emails: vladyslav.turlo@empa.ch
DOI10.24435/materialscloud:8a-gh [version v1]

Publication date: Jun 21, 2024

How to cite this record

Yang Hu, Giacomo Lorenzin, Jeyun Yeom, Manura Liyanage, William Curtin, Lars Jeurgens, Jolanta Janczak-Rusch, Claudia Cancellieri, Vladyslav Turlo, Uncovering the origin of interface stress enhancement and compressive-to-tensile stress transition in immiscible nanomultilayers, Materials Cloud Archive 2024.92 (2024), https://doi.org/10.24435/materialscloud:8a-gh

Description

The intrinsic stress in nanomultilayers (NMLs) is typically dominated by interface stress, which is particularly high in immiscible Cu/W NMLs. Here, atomistic simulations with a chemically-accurate neural network potential reveal the role of interfacial intermixing and metastable phase formation on the interface stress levels. These results rationalize an experimentally-reported compressive-to-tensile transition as a function of NML deposition conditions and the extremely high interface stresses under some conditions.

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inter_stress.zip
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8.8 MiB Experimental and modeling data supporting the research work. The corresponding readme files are provided inside the archives.

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Files and data are licensed under the terms of the following license: Creative Commons Attribution 4.0 International.
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External references

Preprint
Y. Hu, G. Lorenzin, J. Yeom, M. Liyanage, W. Curtin, L. Jeurgens, J. Janczak-Rusch, C. Cancellieri, V. Turlo, to be submitted

Keywords

interface stress Cu/W nanomultilayers molecular statics intermixing metastable phases MARVEL/DD1

Version history:

2024.92 (version v1) [This version] Jun 21, 2024 DOI10.24435/materialscloud:8a-gh